Challenges and Solutions to Meet Future Cost Targets

Since LED became an attractive alternative for general lighting, the market demand for higher brightness, higher efficiency and lower costs was the motivation for improving the LED tech – nology. Whereas an increase in brightness and efficiency is mostly a question of the LED chip design, a reduction of the costs is in the focus […]

Additive Reality: Drops of Technology

The solder mask application revolves around the solder mask material. Still, not all the attention should end on the material alone. The inkjet printed solder mask layer will be made of a collection of drops; next to the solder mask ink, a few other materials play a role in the shaping of these drops. My previous […]

Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration

SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and SET will provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked […]